The UFBGA system addresses all electronic product producing companies where miniaturisation is a major concern. This includes electronics for aerospace, automotive, mobile phones and laptops.

Ball Grid Arrays (BGAs) is a key technology that simultaneously addresses the requirements for high density fine feature electrical interconnect and physical attachment of silicon chip devices. BGA is a 2-D array of miniature solder alloy spheres under the silicon chip that provides both electrical connection and mechanical attachment to a mounting socket or circuit board. The small diameter of the solder alloy spheres reduces electrical resistance and capacitance and helps to preserve electrical signal integrity. BGA technology facilitates a reduction in the silicon chip package size, better heat dissipation, and greater module (circuit) densities.

The use of current BGA technology for UFBGA production leads to poor quality product batches. Therefore, current manufacturing processes are commercially not viable due to high production costs resulting from low yields and the consequent wastage of material.

The project aims at proving technical feasibility of producing UFBGA spheres via a commercially viable process.

Consortium aspiring to achieve this target, consists of the following companies:

BizEsp: Solder materials manufacturers (BizEsp)
KCC: Technology τo separate the solder flow into exact size UFBGAs.
IKH: Man-machine interfaces
ABIS: Industrial process systems. Develop the world’s first UFBGA prototype.